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Potting compound suitable for potting an electronic component

机译：适用于灌封电子元件的灌封胶

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摘要

The invention relates to a potting compound suitable for potting an electronic component, in particular a large-volume coil such as a gradient coil, consisting of a supporting matrix in which at least one filler made of polymer nanoparticles is distributed. At least one filler (11) that is used as a flame retardant is introduced into the supporting matrix (8).

机译：本发明涉及一种适合于浇铸电子元件的浇铸化合物，所述浇铸化合物尤其是大体积线圈，例如梯度线圈，其由支撑基质组成，其中分布有至少一种由聚合物纳米颗粒制成的填料。将至少一种用作阻燃剂的填料（ 11 ）引入支撑基质（ 8 ）中。 展开▼

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公开/公告号US9074108B2

专利类型

公开/公告日2015-07-07

原文格式PDF

申请/专利权人 JÜRGEN HUBER;LOTHAR SCHÖN;MATTHIAS ÜBLER;
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申请/专利号US201113701509

发明设计人 JÜRGEN HUBER;LOTHAR SCHÖN;MATTHIAS ÜBLER;
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申请日2011-05-13

分类号C09D147/00;G01R33/385;H01F5/06;C08K3/00;C08K5/00;H01F41/12;

国家 US

入库时间 2022-08-21 15:18:00

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