首页> 外国专利> Method and means for coupling high-frequency energy to and/or from the nanoscale junction of an electrically-conductive tip with a semiconductor

Method and means for coupling high-frequency energy to and/or from the nanoscale junction of an electrically-conductive tip with a semiconductor

机译:用于将高频能量与导电尖端的纳米级结与半导体耦合和/或从其耦合的方法和装置

摘要

A method for coupling high-frequency energy, in particular for microwave circuits, to a nanoscale junction involves placing a bias-T outside of the tip and sample circuits of a scanning probe microscope and connecting a portion of a sample of analyzed semi-conductor through an outer shielding layer of coaxial cable so as to complete a circuit with minimal involvement of the sample. The bias-T branches into high and low-frequency circuits, both of which are completed and, at least the high-frequency circuit, does not rely on grounding of implements or other structure to accomplish said completion.
机译:一种将高频能量(特别是用于微波电路的高频能量)耦合到纳米级结的方法,该方法包括将T偏置T置于扫描探针显微镜的尖端和样品电路的外部,并通过一部分连接被分析的半导体样品的一部分同轴电缆的外部屏蔽层,以使电路在样品受累最少的情况下完成。偏置T分支为高频电路和低频电路,两者均已完成,并且至少高频电路不依赖于工具或其他结构的接地来完成所述完成。

著录项

  • 公开/公告号US9075081B2

    专利类型

  • 公开/公告日2015-07-07

    原文格式PDF

  • 申请/专利权人 MARK J. HAGMANN;

    申请/专利号US201414223727

  • 发明设计人 MARK J. HAGMANN;

    申请日2014-03-24

  • 分类号G01Q30/20;G01Q60/16;G01Q60/10;G01Q60/00;

  • 国家 US

  • 入库时间 2022-08-21 15:17:52

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