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Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the same
Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the same
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机译:高导热聚酰亚胺膜,高导热覆金属层压板及其制造方法
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摘要
A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length DL of 0.1-15 μm and a spherical filler with an average particle diameter DR of 0.05-10 μm, DL and DR satisfy the relationship DLDR/2, no heat conductive filler of 30 μm or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.
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机译:可以包括在高导热聚酰亚胺膜中的高导热金属包覆层压板在具有导热填充填料的聚酰亚胺层的绝缘层的一侧或两侧具有金属层。具有填充有填料的聚酰亚胺层的高导热性金属包覆层压板或高导热性聚酰亚胺膜的绝缘层的特征在于,填充有填料的聚酰亚胺层中的导热性填料的含量为20〜80重量% ,该导热填料包含平均长度D L Sub>为0.1-15μm的板状填料和平均粒径D R Sub>为0.05- 10μm,D L Sub>和D R Sub>满足关系D L Sub D R Sub> / 2,不导热包含30μm或更大的填料,并且热膨胀系数在10-30ppm / K的范围内。
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