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Interlocking type solder connections for alignment and bonding of wafers and/or substrates
Interlocking type solder connections for alignment and bonding of wafers and/or substrates
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机译:互锁式焊料连接,用于晶圆和/或基板的对准和键合
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摘要
An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.
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