copper metallization process for use in the manufacture of an integrated circuit by using the wafer level packaging technology, 3d

摘要

method of bonding to copper based, connection line (32)) and vias through 34 (fig.a) for use in the manufacture of an integrated circuit of an image sensor in general. in particular, the wafer level packaging technology, using 3d to reduce the co production, and improved electrical performance at the level of the particular image sensor 1 and said for the realization of interconnects in integrated circuits in three dimensions.