首页> 外国专利> THE METHOD OF POLISHING A DIAMOND-ABRASIVE TAPE CYLINDRICAL PARTS WITH HIGH-COMPOSITES BASED ON ALUMINUM IN PRINTING TECHNOLOGY

THE METHOD OF POLISHING A DIAMOND-ABRASIVE TAPE CYLINDRICAL PARTS WITH HIGH-COMPOSITES BASED ON ALUMINUM IN PRINTING TECHNOLOGY

机译:基于铝的高铝复合金刚石砂带圆柱体零件的抛光方法

摘要

The method of polishing a diamond-abrasive tape cylindrical parts with high-composites based on aluminum in printing technology, which part is recorded in the device with the possibility of rotation around its axis with the normalized speed simultaneous fluid vibrations along the axis parts and dense contact surfaces processing with flexible elastic band which moves in contact with the workpiece machined perpendicular to the axis of rotation of the calculated speed. For polishing using elastic flexible strip of polyethylene terephthalate basis on which the work surface binder of poly-vinyl-butyralyu and rezolnoyi phenol-formaldehyde resin in a ratio of 1: 1 by weight assigned flours synthetic diamond (AS) 0.5-3 microns in grain 100% of the first concentration of diamond thick strip foundations within 10-20 microns and the diamond layer within 1,5-5 microns. Immediately mikrostruzhok cutting of the workpiece surface is performed with specified cutting conditions.
机译:在印刷技术中用铝对高复合材料的金刚石磨料带圆筒形零件进行抛光的方法,该零件记录在设备中,并可能绕其轴旋转,并且归一化的速度同时使流体沿轴部分振动并且致密接触面用柔性弹性带加工,弹性带在与计算出的转速的旋转轴垂直的方向上与加工的工件接触移动。用于使用聚对苯二甲酸乙二酯的弹性挠性条进行抛光,其基础上以重量比为1:1的聚乙烯基-丁缩醛和雷佐诺伊酚醛树脂的工作表面粘合剂分配给面粉中合成金刚石(AS)0.5-3微米金刚石厚条状粉底的第一浓度的100%在10-20微米内,金刚石层在1.5-5微米内。立即在指定的切削条件下进行工件表面的mikrostruzhok切削。

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