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RERAM MATERIALS STACK FOR LOW-OPERATING-POWER AND HIGH-DENSITY APPLICATIONS
RERAM MATERIALS STACK FOR LOW-OPERATING-POWER AND HIGH-DENSITY APPLICATIONS
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机译:低功率和高密度应用的RERAM材料堆栈
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摘要
A switching element for resistive-switching memory (ReRAM) provides a controllable, consistent filament break-point at an abrupt structural discontinuity between a layer of high-k high-ionicity variable-resistance (VR) material and a layer of low-k low-ionicity VR material. The high-ionicity layer may be crystalline and the low-ionicity layer may be amorphous. The consistent break-point and characteristics of the low-ionicity layer facilitate lower-power operation. The defects (e.g., oxygen or nitrogen vacancies) that constitute the filament originate either in the high-ionicity VR layer or in a source electrode. The electrode nearest to the low-ionicity layer may be intrinsically inert or may be rendered effectively inert. Some electrodes are rendered effectively inert by the creation of the low-ionicity layer over the electrode.
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