EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR REFLECTORS, THERMOSETTING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICES OBTAINED USING SAID THERMOSETTING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES, SEALED OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

The present invention is an optical semiconductor device which is provided with: a metal lead frame that is composed of a first plate part (1) and a second plate part (2); and a reflector (4) that is formed so as to surround an optical semiconductor element (3) that is mounted on the metal lead frame. The material forming the reflector (4) is composed of a thermosetting resin composition for optical semiconductor devices, which contains (A) a thermosetting resin , (B) a white pigment having a bandgap of 3.3-5.5 eV and (C) an inorganic filler. Consequently, an optical semiconductor device of the present invention has not only high initial light reflectance, but also excellent long-term light resistance.