For an optical semiconductor reflector epoxy resin composition, an optical semiconductor device for the thermosetting resin composition and the optical semiconductor device lead frame obtained therewith, sealing optical semiconductor elements and optical semiconductor devices

摘要

The present invention includes a metal lead frame including a first plate portion 1 and a second plate portion 2 and a reflector 4 formed so as to surround the periphery of the optical semiconductor element 3 mounted on the metal lead frame (A), a white pigment (B) having a band gap (forbidden band) of 3.3 to 5.5 eV, and an inorganic filler (C) in the optical semiconductor device, wherein the material for forming the reflector 4 is a thermosetting resin And a thermosetting resin composition for an optical semiconductor device containing the thermosetting resin. Therefore, not only high initial light reflectance but also excellent long-term light fastness are provided.