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WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
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机译:脉冲紫外光源的晶圆背面涂层工艺
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摘要
A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.
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