首页> 外国专利> Method of structuring a device layer of a recessed semiconductor device and recessed semiconductor device comprising a structured device layer

Method of structuring a device layer of a recessed semiconductor device and recessed semiconductor device comprising a structured device layer

机译:构造凹陷半导体器件的器件层的方法以及包括结构化器件层的凹陷半导体器件

摘要

A device layer of a recessed semiconductor device is structured by a method comprising the steps of providing a semiconductor substrate (1) with a device layer (2) having a surface (10), forming a recess (3) extending from the surface into the substrate, and structuring the device layer. A dry film (4) is applied on the surface of the device layer after forming the recess and before structuring the device layer, so that the dry film covers the recess. A resist layer (6) is applied on or above the dry film and is patterned into a resist mask. A dry film pattern is formed from the dry film according to the pattern of the resist mask. The device layer is structured using the dry film pattern as an etch mask.
机译:凹入的半导体器件的器件层通过一种方法来构造,该方法包括以下步骤:为半导体衬底(1)提供具有表面(10)的器件层(2),形成从表面延伸到半导体衬底(1)的凹部(3)。衬底,并构造器件层。在形成凹槽之后并且在构造器件层之前,将干膜(4)施加在器件层的表面上,使得干膜覆盖凹槽。将抗蚀剂层(6)施加在干膜之上或之上,并且将其构图成抗蚀剂掩模。根据抗蚀剂掩模的图案由干膜形成干膜图案。使用干膜图案作为蚀刻掩模来构造器件层。

著录项

  • 公开/公告号EP2802004A1

    专利类型

  • 公开/公告日2014-11-12

    原文格式PDF

  • 申请/专利权人 AMS AG;

    申请/专利号EP20130167088

  • 发明设计人 LÖFFLER BERNHARD;SCHREMS MARTIN;

    申请日2013-05-08

  • 分类号H01L21/311;H01L21/3213;H01L21/768;

  • 国家 EP

  • 入库时间 2022-08-21 15:05:03

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号