首页> 外国专利> SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER, POWER MODULE HAVING METAL MEMBER, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER

SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER, POWER MODULE HAVING METAL MEMBER, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER

机译:用于功率模块的基质,用于具有金属成员的功率模块的基质,用于金属模块的功率模块,用于制造功率模块的基质的方法,用于制造具有金属模块的功率模块的基质的方法

摘要

A power module substrate includes an insulating layer (11), a circuit layer (12) that is formed on a first surface of the insulating layer, and a metal layer (13) that is formed on a second surface of the insulating layer, in which a first base layer (20) is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.
机译:功率模块基板包括:绝缘层(11);形成在绝缘层的第一表面上的电路层(12);以及形成在绝缘层的第二表面上的金属层(13)。第一基础层(20)被层压在金属层的与设置有绝缘层的表面相反的一侧的表面上,并且第一基础层具有:第一玻璃层,该第一玻璃层形成在与金属层;第一Ag层层叠在第一玻璃层上。

著录项

  • 公开/公告号EP2940727A1

    专利类型

  • 公开/公告日2015-11-04

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORPORATION;

    申请/专利号EP20130866760

  • 发明设计人 NISHIMOTO SHUJI;NAGATOMO YOSHIYUKI;

    申请日2013-12-20

  • 分类号H01L23/36;H01L23/40;H05K1/02;

  • 国家 EP

  • 入库时间 2022-08-21 15:01:34

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