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SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER, POWER MODULE HAVING METAL MEMBER, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER
SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER, POWER MODULE HAVING METAL MEMBER, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE HAVING METAL MEMBER
A power module substrate includes an insulating layer (11), a circuit layer (12) that is formed on a first surface of the insulating layer, and a metal layer (13) that is formed on a second surface of the insulating layer, in which a first base layer (20) is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.
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