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PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DICE AND DIE ASSEMBLIES INCLUDING SUCH INTERCONNECT STRUCTURES, AND RELATED METHODS
PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DICE AND DIE ASSEMBLIES INCLUDING SUCH INTERCONNECT STRUCTURES, AND RELATED METHODS
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机译:包括这种互连结构的PAD互连结构,半导体管芯和管芯组件上的支柱以及相关方法
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摘要
Methods of fabricating interconnect structures for semiconductor dice comprise forming conductive elements in contact with bond pads on an active surface over a full pillar diameter of the conductive elements, followed by application of a photodefinable material comprising a photoresist to the active surface and over the conductive elements. The polyimide material is selectively exposed and developed to remove photodefinable material covering at least tops of the conductive elements. Semiconductor dice and semiconductor die assemblies are also disclosed.
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