TARGET COOLING FOR PHYSICAL VAPOR DEPOSITION (PVD) PROCESSING SYSTEMS

摘要

substrate processing system in use for target assemblies to be present at the offering. In some embodiments, the substrate processing target assembly for use in a system, the source material to be deposited on the substrate, the first backing plate, said first backing plate supporting the source material on the front side of the first backing plate configured to, the front surface of the source material is also opposite to the substrate, if any, -, first the second coupled to the back side of the backing plate backing plate, and is disposed between the first backing plate and the second backing plate It may comprise a plurality of sets of channels. These channels, the coolant ten won; provided by allowing closer to (the target surface target face), to facilitate more efficient heat removal from the target. Efficient heat removal than from the target brings as a result the target having a smaller thermal gradient and less mechanical bending accordingly (bowing) / modifications.