THERMOPLASTIC RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE AND LOW PERMITTIVITY, PREPREG AND COPPER CLAD LAMINATE USING THE SAME

摘要

The present invention provides: a thermosetting resin composition comprising (a) bisphenol M-type epoxy resin, (b) bisphenol M-type cyanate ester resin, (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or an oligomer thereof, and (d) a cross-linking curing agent; prepreg comprising the composition; and a printed circuit board. The present invention can provide a printed circuit board simultaneously having an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.