THERMOPLASTIC RESIN COMPOSITION FOR HIGH FREQUENCY HAVING LOW PERMITTIVITY, PREPREG AND COPPER CLAD LAMINATE USING THE SAME

摘要

The present invention provides a non-epoxy based thermosetting resin composition for high frequency, comprising: (a) a polyphenylene ether resin having two or more unsaturated substituents selected from the group consisting of a vinyl group and an allyl group at both terminals of a molecule chain, or an oligomer thereof; and (b) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The present invention can provide a printed circuit board for high frequency which simultaneously exhibits excellent low dielectric loss properties, good moisture-absorbing and heat-resistant properties, low-thermal expansion properties, and thermal stability.