SN-AG-CU-BASED SOLDER POWDER, AND SOLDER PASTE USING SAID POWDER

摘要

As the solder powder below-average particle size of 5 , a melting point of the solder powder surface 250 SnAgCu-based solder powder is a dry product is formed is attached as an additive to or lower hydroxy acid or a solution of the ester. The additive is preferably a salicylic acid, 3,4-dihydroxy-benzoic acid ethyl or 3,5-dihydroxy-benzoate. The coating weight of the additive, tin is contained in the solder powder, and 0.01 to 1.0 parts by mass with respect to 100 parts by mass of the total amount of components of copper, the silver content of the tin, when the total amount of components of copper 100% by weight, When an amount of 0.1 to 10% by weight and ratio of tin, the content of copper, when the total amount of components of copper 100% by weight and 0.1 to 2.0% by weight, preferably the balance being made of tin.