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RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

机译:具有内部谐波频率降低的射频功率晶体管封装以及形成具有内部谐波频率降低的射频功率晶体管封装的方法

摘要

A packaged RF power device includes a transistor having a control terminal and an output terminal and configured to operate at a fundamental operating frequency, an RF signal input lead coupled to the control terminal, and an RF signal output lead coupled to the output terminal. A harmonic reducer is coupled to the control terminal and/or the output terminal of the transistor and is configured to provide a short circuit or low impedance path from the control terminal and/or the output terminal to ground for signals at an Nth harmonic frequency of the fundamental operating frequency, where N1. The device further includes a package that houses the transistor and the harmonic reducer, with the input lead and the output lead extending from the package. Multi-chip packages are also disclosed.
机译:封装的RF功率器件包括:晶体管,其具有控制端子和输出端子,并且被配置为以基本工作频率进行操作; RF信号输入引线,其耦合至控制端子;以及RF信号输出引线,其耦合至输出端子。谐波减小器耦合到晶体管的控制端子和/或输出端子,并配置为提供从控制端子和/或输出端子到地的短路或低阻抗路径,用于信号的N次谐波频率为。基本工作频率,其中N> 1。该装置还包括容纳晶体管和谐波减小器的封装,其中输入引线和输出引线从该封装延伸。还公开了多芯片封装。

著录项

  • 公开/公告号KR101487570B1

    专利类型

  • 公开/公告日2015-01-29

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20107001178

  • 发明设计人 파렐 도널드;우드 사이먼;

    申请日2008-05-28

  • 分类号H01L23/66;H03F1/56;

  • 国家 KR

  • 入库时间 2022-08-21 14:58:43

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