A method for de-bonding of device wafer and carrier wafer and apparatus for de-bonding

摘要

The present invention relates to a method and apparatus for de-bonding of the device wafer and the carrier wafer , as a device wafer and a method for de-bonding the light-heat conversion layer and the UV coating layer is bonded to the bonded wafer between the carrier wafer, a) a light-transmitting side of the wafer carrier is to examine the dose-controlled laser bumps on the device wafer of the lower and preventing the chip from being damaged, and decomposing the photo-thermal conversion layer; 2) light-heat step of separating the wafer from the carrier one end of the device wafer in a state conversion layer is a top exploded carrier wafer to position the de-bonding means to the vacuum contact; 3) comprising a carrier wafer coated with a separation layer on a UV protection layer at the time of the UV layer and open; And 4) and then be cured with UV sticking layer a protective layer separating the protective layer using the release tape; includes ;