Plazma cleaning apparatus for manufacturing semiconductor package

摘要

The present invention relates to a plasma cleaning apparatus for cleaning a semiconductor component (lead frame or PCB) for plasma discharge in a semiconductor manufacturing process and, more particularly, to a plasma cleaning apparatus for cleaning a semiconductor package, capable of minimizing defects caused when plasma is cleansed while a lead frame is bent. For this, in a plasma cleaning chamber which includes a bottom plate (110) on which the lead frame (L) is received, a top plate (120) which is installed on the upper side of the bottom plate to be lifted, is combined with the bottom plate, and includes a preset inner space to generate plasma when the top plate is combined with the bottom plate, and a pair of guide rails (130) which are fixed on the bottom plate in parallel and supports the lead frame to be separated from the bottom plate, the present invention includes a pushing member (140) which is horizontally installed in the inner space of the top plate and presses the guide rail and the lead frame which is received on the guide rail when the top plate is combined with the bottom plate, an elastic support pin (150) whose both ends are supported on the pushing member and the inner bottom surface of the top plate to give vertical elasticity to the pushing member, and a damper (160) which is formed on the guide rail and absorbs an impact which is transmitted from the pushing member.