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FLEXIBLE PRINTED CIRCUIT BOARD BY LASER PROCESSING AND PRINTING PROCESS, AND METHOD FOR MANUFACTURING THE SAME

机译:激光加工和印刷工艺的柔性印刷电路板及其制造方法

摘要

the present invention is required in a predetermined pattern on the substrate surface () type of home is formed, the substrate, formed by printing a conductive paste composition according to the yaw () in the form of a predetermined pattern of grooves formed on the substrate surface and the lower end is the yaw () filling the remainder of the home in the form of a substrate the wiring layer is formed so as to protrude in order to improve the electroless metal layer and the wiring layer and the electrical conductivity of the wire composed of the electroless metal coating layer formed on the wiring layer, printing the electroless plated layer comprises a metal plating layer formed in addition to the metal It is on the substrate and a method of manufacturing the circuit. ;
机译:本发明要求在基板上以预定图案形成表面()的类型,该基板通过以根据预定方式形成的凹槽的预定图案的形式印刷根据偏航()的导电浆料组合物而形成表面和下端是偏航(),以基板的形式填充房屋的其余部分,形成布线层以便突出,以改善化学镀金属层和布线层以及导线的导电性由形成在布线层上的化学镀层构成的印刷层,除了在基板上印刷金属以外,还包括形成有金属镀层的金属镀层及其制造方法。 ;

著录项

  • 公开/公告号KR1015204120000B1

    专利类型

  • 公开/公告日2015-05-15

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR1020130021682

  • 发明设计人 최은국;김충한;김성철;윤종선;

    申请日2013-02-28

  • 分类号H05K3/00;H05K1/02;H05K3/18;

  • 国家 KR

  • 入库时间 2022-08-21 14:58:11

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