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Printing as an Alternative Manufacturing Process for Printed Circuit Boards

机译：印刷作为印刷电路板的替代制造工艺

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Huw Lewis; Alan Ry;
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1. Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating [J] . Park Janghoon, Lee Jongsu, Park Sungsik, The International Journal of Advanced Manufacturing Technology . 2016,第9a12期

机译：使用卷对卷凹版印刷，通孔印刷和化学镀技术开发双面柔性印刷电路板的混合工艺
2. Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating [J] . Park Janghoon, Lee Jongsu, Park Sungsik, The International Journal of Advanced Manufacturing Technology . 2016,第9a12期

机译：使用卷对卷凹版印刷，通孔印刷和化学镀技术开发双面柔性印刷电路板的混合工艺
3. Shorter circuit: The horizontal 'Graphite 2000' process is shorter than the electroless copper processes used in the manufacture of some printed circuit boards [J] . Product Finishing . 1998,第10期

机译：电路更短：水平的“ Graphite 2000”工艺比某些印刷电路板制造中使用的化学镀铜工艺更短
4. Processing Gerber files for manufacturing printed circuit boards [C] . Arturo Moreno-Baez, Gerardo Miramontes-de Leon, Ernesto Garcia-Dominguez International Meeting of Electrical Engineering Research . 2013

机译：处理Gerber文件以制造印刷电路板
5. Measurement and use of process capability in statistical process control activities in a printed circuit board manufacturing domain. [D] . Dogdu, Sezai. 1999

机译：测量和使用印刷电路板制造领域中统计过程控制活动中的过程能力。
6. Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms [O] . Philipp Nothdurft, Gisbert Riess, Wolfgang Kern 2019

机译：印刷电路板中的铜/环氧树脂接头：制造和界面破坏机制
7. An inktjet printing-based process chain for conductive structures on printed circuit board materials [O] . Sridhar, Ashok 2010

机译：基于inktjet印刷的工艺链，用于印刷电路板材料上的导电结构
8. Economic Census 2002: Manufacturing, Industry Series. Bare Printed Circuit Board Manufacturing [R] . 2005

机译：2002年经济普查：制造业，工业系列。裸印刷电路板制造业

Printing as an Alternative Manufacturing Process for Printed Circuit Boards

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