MICROSTRIP LINE COMBINED BY INDUCTIVE AND CAPACITIVE PERTURBATIONS AND WIRELESS CIRCUIT APPARATUS USING THE SAME

摘要

Disclosed are a microstrip line combined by inductive and capacitive perturbations and a wireless circuit apparatus using the same. A microstrip line includes a first dielectric layer; a transmission line formed on one side of the first dielectric layer; a second dielectric layer and a ground conductor layer which are successively formed on the back of the first dielectric layer. It includes a defect ground structure (DGS) formed by a window on the ground conductor layer, and a substrate integrated artificial dielectric (SIAD) structure formed by plated via holes which penetrate a second dielectric layer. Thereby, a new structure where the DGS and the SIAD are combined with an optimal shape is suggested. A circuit can be minimized by maximally reducing the length of a line. At the same time, electrical performance can be maintained by a similar line width to a standard type.