APPARATUS FOR EPOXY IMPREGNATION OF NO-INSULATION HTS COIL, AND METHOD THEREOF

摘要

An epoxy impregnation apparatus according to the present invention comprises: a mold on which a coil is disposed and which moves with the coil to come into contact with epoxy to impregnate the coil with the epoxy; a mold transport unit connected to the mold to vertically move the mold or horizontally rotate the mold; a guide which forms a cavity to fill the inside thereof with the epoxy up to a prescribed height and is formed in a pillar shape enclosing a moving radius of the mold transport unit; and a chamber on which the mold, the mold transport unit, and the guide are disposed and, wherein a cavity in vacuum is formed inside thereof. Bubbles remaining in the epoxy are removed before impregnation, and an amount of epoxy coated on the coil is adjusted by rotating the mold after the impregnation.