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METHOD OF FORMING pads To YBa2Cu3O7-x film

机译:在YBa2Cu3O7-x膜上形成焊盘的方法

摘要

A method of forming on the dielectric substrate to pads YBaCuOplenkam, wherein the contact pads are formed prior to application of films YBaCuOna dielectric substrate, characterized in that the heating is the target and the substrate to a temperature T = 450-500 ° C, spraying pad of Au (gold) is performed by laser sputtering target made of solid gold pulsed laser with a wavelength of λ = 1,06 microns, a pulse duration of τ = 10 ÷ 20 ns, and pulse repetition frequency ν = 10 Hz, power density laser rad cheniya P = (5 ÷ 7) · 10W / cm, the dielectric substrate is set at a distance L = 4-6 mm from the gold target at a pressure in the vacuum chamber r = 0.1 ÷ 0.5 Pa.
机译:一种在介电基板上形成焊盘YBaCuOplenkam的方法,其中在施加膜YBaCuOna介电基板之前形成接触焊盘,其特征在于加热是将靶材和基板加热到温度T = 450-500°C,喷涂Au(金)的抛光垫是通过由波长为λ= 1,06微米,脉冲持续时间τ= 10÷20 ns,脉冲重复频率ν= 10 Hz的固体金脉冲激光器制成的激光溅射靶执行的,功率密度激光rad cheniya P =(5÷7)·10W / cm,在真空室中的压力r = 0.1÷0.5 Pa的情况下,将介电基片设置为与金靶的距离L = 4-6 mm。

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