DEVICE FOR REMOVING TIN-LEAD SANDS FROM ELECTRONIC PRINTED BOARDS WITH THE INFLUENCE OF CENTRIFUGAL FORCES ON ELECTRONIC PRESSED BARS WITH SULFUR GRAIN, SULFUR

摘要

A device for extracting tin-lead solders from scrap electronic printed circuit boards by using centrifugal forces on the scrap of electronic printed circuit boards in a liquid heat carrier heated above the melting point of tin-lead solder in the range from 150 ° C to 320 ° C, characterized in that includes a perforated drum, the drum can rotate, the electronic circuit boards are loaded into the drum, the drum is inside the tank, the tank contains a heat transfer fluid heated above the melting point of tin-lead solder in the range of 150 ° C to 320 ° C.