A device for extracting tin-lead solders from scrap of electronic printed circuit boards by the action of centrifugal forces on the scrap of electronic printed circuit boards in a gas or steam environment heated above the melting point of tin-lead solder

摘要

A device for extracting tin-lead solders from scrap of electronic printed circuit boards by the action of centrifugal forces on the scrap of electronic printed circuit boards in gas or steam heated above the melting point of tin-lead solder, characterized in that it includes a perforated drum for loading into it electronic printed circuit boards, made with the possibility of rotation and located inside the tank with gas or steam heated above the melting temperature of tin-lead solder.