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METHOD OF FORMING CONTACT PADS ON YBA2CU3O7-x FILMS

机译:在YBA 2 CU 3 O 7-x 薄膜上形成接触垫的方法

摘要

FIELD: chemistry.;SUBSTANCE: invention relates to formation of gold contact pads on YBa2Cu3O7-x films on dielectric substrates. In the method of forming gold contact pads on YBa2Cu3O7-x films on a dielectric substrate, contact pads are formed before sputtering YBa2Cu3O7-x films on the dielectric substrate by heating a target and a substrate to 450-500°C, spraying the gold contact pad by laser sputtering a target made of gold with a solid-state pulsed laser with radiation wavelength of 1.06 mcm, pulse duration of 10-20 ns, pulse repetition frequency of 10 Hz and laser radiation power density of (5-7)·108 W/cm2. The dielectric substrate is placed 4-6 mm from the gold target with the working surface facing the target, at vacuum chamber pressure of 0.1-0.5 Pa.;EFFECT: obtaining high-quality gold contact pads on superconducting films.;2 dwg
机译:发明领域本发明涉及在电介质衬底上的YBa 2 Cu 3 O 7-x 膜上形成金接触垫。在介电基板上的YBa 2 Cu 3 O 7-x 膜上形成金接触垫的方法中,在溅射之前形成接触垫。通过将靶材和基板加热到450-500°C,然后喷涂YBa 2 Cu 3 O 7-x 通过用波长为1.06 mcm,脉冲持续时间为10-20 ns,脉冲重复频率为10 Hz且激光辐射功率密度为(5-7)的固态脉冲激光器对由金制成的靶进行激光溅射来形成金接触垫·10 8 W / cm 2 。将电介质基板放置在距金靶4-6 mm的位置,使工作表面面向靶,在0.1-0.5 Pa的真空室压力下;效果:在超导膜上获得高质量的金接触垫; 2 dwg

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