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Parallel optical transmitter - and / or receivers - module and method for the heat dissipating in a parallel optical transmitters - and / or receivers - module
Parallel optical transmitter - and / or receivers - module and method for the heat dissipating in a parallel optical transmitters - and / or receivers - module
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机译:并行光发送器和/或接收器模块以及用于并行光发送器和/或接收器模块散热的方法
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摘要
Parallel optical transmitter - and / or receivers - module (1) comprising:an electrical subunit (30) comprising a printed circuit board (70), a guide frame (40), which, on the printed circuit board (70) is attached, at least one integrated circuit (50a – 50l), abbreviated to ic, the on an upper surface (40a) of the guide frame (40) is fastened, and a plurality of active, optical means (60a – 60l) which, on the upper surface (40a) of the guide frame (40) are fixed, whereby the electrical subunit (30) one or more alignment - and locking features has thereon;an optical subunit (20) comprising a plurality of optical elements for the conduction of optical signals between ends of a plurality of optical fibers and the active, optical means (60a – 60l) which, on the upper surface (40a) of the guide frame (40) are fastened, has, wherein the optical subunit (20) one or more alignment - and locking features which are configured, in order to alignment - and locking features of the electrical subunit (30) and with them to be aligned to be locked, in order to make it possible for the electrical subunit (30) and the optical subunit (20) are coupled mechanically to one another; anda heat dissipating system (10), the mechanically with the optical subunit (20) is coupled, wherein said heat dissipating system (10) has a material with high thermal conductivity, wherein said heat dissipating system (10), at least one surface (10d, 10f) has, the thermally with the upper surface (40a) of the guide frame (40) of the electrical subunit (30) is coupled, if the optical subunit (20) and the electrical subunit (30) are coupled mechanically to one another, in order to make it possible for heat from the guide frame (40) into the heat dissipation system (10) is transmitted, and wherein said heat dissipating system (10) is configured, ..
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