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Optical Transceiver With VCSEL Transmitter And Receiver Array Modules For High Speed Parallel Communications On The Optical Backplane

机译:带有VCSEL发送器和接收器阵列模块的光收发器,用于在光背板上进行高速并行通信

摘要

PURPOSE: An optical transceiving device having a VCSEL(Vertical Cavity Surface Emitting Laser) transmitter array module and an optical detector array module for optical backplane high-speed parallel communication is provided to enable a vertical array between optical light guide paths of an optical backplane, and to easily enable optical/electrical arrays by using array guides on a PCB, then to transceive high-speed signal data on many channels, thereby magnifying system capacity. CONSTITUTION: A photo diode array(1) is fixed into a lower substrate(9) with an FCB(Flip Chip Boding) unit(3). A receiver array(2) is fixed into the lower substrate(9) with the FCB(3) in order to drive the photo diode array(1). A micro lens array(10) condenses inputted/outputted light into the lower substrate(9). Leads(6,8) are electrically connected with external components of an optical detector array module. A housing(5) protects the optical detector array module. Many holes(14) are formed on the lower substrate(9) for electrical connections between the photo diode array(1) and the receiver array(2) and for light inputting/outputting. The holes(14) pierce through the lower substrate(9), emitting light inputted/outputted from the photo diode array(1) to the micro lens array(10).
机译:用途:提供一种具有VCSEL(垂直腔表面发射激光器)发射器阵列模块和用于光背板高速并行通信的光检测器阵列模块的光收发装置,以实现光背板的光导路径之间的垂直阵列,并通过使用PCB上的阵列导向器轻松启用光电阵列,然后在许多通道上收发高速信号数据,从而扩大了系统容量。组成:光电二极管阵列(1)通过FCB(倒装芯片键合)单元(3)固定在下基板(9)中。接收器阵列(2)通过FCB(3)固定在下基板(9)中,以驱动光电二极管阵列(1)。微透镜阵列(10)将输入/输出的光会聚到下基板(9)中。导线(6,8)与光学检测器阵列模块的外部组件电连接。外壳(5)保护光学探测器阵列模块。在下基板(9)上形成许多孔(14),用于光电二极管阵列(1)和接收器阵列(2)之间的电连接以及光的输入/输出。孔(14)穿过下基板(9),将从光电二极管阵列(1)输入/输出的光发射到微透镜阵列(10)。

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