METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE COMPRISING A NOVEL GAS INJECTION THROUGH A MATERIAL PERMEABLE TO THIS NOBLE GAS

摘要

A method of encapsulating a microelectronic device (102.1, 102.2), comprising the steps of: - producing the microelectronic device on a first substrate (104); - Making a portion (118.1, 118.2) of a first non-permeable material in the ambient atmosphere and permeable to a noble gas in a second substrate (108) based on a second non-permeable material in the ambient atmosphere and noble gas; - Securing the second substrate to the first substrate, forming at least one cavity (120.1, 120.2) in which is encapsulated the microelectronic device such that said portion of the first material forms part of a wall of the cavity; injecting the noble gas into the cavity through the portion of the first material; - Hermetic sealing of the cavity vis-à-vis the ambient atmosphere and the noble gas.