首页> 外国专利> METHOD FOR PRODUCING NMOS AND PMOS TRANSISTORS ON A SOI-TYPE SUBSTRATE, ESPECIALLY FDSOI, AND CORRESPONDING INTEGRATED CIRCUIT

METHOD FOR PRODUCING NMOS AND PMOS TRANSISTORS ON A SOI-TYPE SUBSTRATE, ESPECIALLY FDSOI, AND CORRESPONDING INTEGRATED CIRCUIT

机译:在SOI型基板,特别是FDSOI上生产NMOS和PMOS晶体管的方法以及相应的集成电路

摘要

Integrated circuit comprising at least one NMOS transistor (TRN) and at least one PMOS transistor (TRP) on respective different zones (10, 11) of a silicon-on-insulator substrate, each transistor (TRP, TRN) ) comprising, above the substrate, a gate region (RGP, RGN) two multilayer side insulating regions (40-42, 50-52) respectively bearing on two sides of the gate region, resting on the substrate and each comprising a inclined portion (44, 54) flaring away from the substrate, a source region and a drain region each having a semiconductor block (6, 8) resting on the substrate, separated from the corresponding flank of the gate region by the corresponding lateral insulating region and having an inclined portion (60, 80) abutting the inclined portion (44, 54) of said insulating lateral region.
机译:在绝缘体上硅衬底的各个不同区域(10、11)上包括至少一个NMOS晶体管(TRN)和至少一个PMOS晶体管(TRP)的集成电路,每个晶体管(TRP,TRN)在其上方衬底,一个栅区(RGP,RGN),两个多层侧绝缘区(40-42、50-52),分别支撑在栅区的两侧,搁在衬底上,每个都包括向外张开的倾斜部分(44、54)远离衬底的源极区和漏极区均具有放置在衬底上的半导体块(6、8),并通过相应的侧向绝缘区与栅极区的相应侧面分开,并具有倾斜部分(60, 80)邻接所述绝缘侧向区域的倾斜部分(44、54)。

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