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Semiconductor structure for a radiation detector based on the avalanche effect and radiation detector

机译:基于雪崩效应的辐射探测器的半导体结构及辐射​​探测器

摘要

A semiconductor structure (100) comprises a substrate (12) comprising a semiconductor material of a first conductivity type; a semiconductor substrate (14) provided with a semiconductor layer; doping regions (13) of a second conductivity type; an additional doping region (15) provided in the semiconductor substrate and assigned to doping regions; and a cover layer (10) that is provided on the semiconductor substrate and of the second conductivity type, where an avalanche area (44), which is an area of high electrical field strength. A semiconductor structure (100) comprises: (A) a substrate (12) comprising a semiconductor material of a first conductivity type; (B) a semiconductor substrate (14) provided with a semiconductor layer provided on the substrate and having a higher resistance in comparison to the substrate, of the first conductivity type, and electrically doped with a doping concentration; (C) doping regions (13) provided in the semiconductor substrate and separated from each other, of a second conductivity type that is opposite from the first conductivity type, and electrically doped with a doping concentration that is higher than the doping concentration in the semiconductor substrate; (D) an additional doping region (15) provided in the semiconductor substrate and assigned to doping regions, of the first conductivity type, and electrically doped with a doping concentration that is higher than the doping concentration in the semiconductor substrate; and (E) a cover layer (10) that is provided on the semiconductor substrate and of the second conductivity type, where an avalanche area (44), which is an area of high electrical field strength, is provided in the semiconductor substrate between the doping regions provided herein and the cover layer provided on the semiconductor substrate, in which free charge carriers are replicated during operation due to collisions, where a quench area is provided in the semiconductor substrate between the doping regions.
机译:半导体结构(100)包括衬底(12),该衬底包括第一导电类型的半导体材料;设置有半导体层的半导体基板(14)。第二导电类型的掺杂区(13);设置在半导体衬底中并分配给掺杂区的附加掺杂区(15);覆盖层(10)设置在半导体基板上并且具有第二导电类型,其中,雪崩区域(44)是高电场强度的区域。一种半导体结构(100),包括:(A)包括第一导电类型的半导体材料的衬底(12);以及(B)半导体基板(14),在半导体基板(14)上设置有半导体层,该半导体层设置在基板上,并且与基板相比电阻更高,且为第一导电类型,并且以掺杂浓度进行电掺杂。 (C)设置在半导体衬底中并彼此分离的,与第一导电类型相反的第二导电类型的并且以高于半导体中的掺杂浓度的掺杂浓度进行电掺杂的掺杂区域(13)。基质; (D)设置在半导体衬底中并分配给第一导电类型的掺杂区域的附加掺杂区域(15),并且以高于半导体衬底中掺杂浓度的掺杂浓度进行电掺杂; (E)在半导体基板上设置第二导电类型的覆盖层(10),在该半导体基板之间的雪崩区域(44)是高电场强度的区域。这里提供的掺杂区和设置在半导体衬底上的覆盖层,其中在工作期间由于碰撞而复制了自由电荷载流子,其中在掺杂区之间的半导体衬底中提供了淬火区。

著录项

  • 公开/公告号EP2629340A3

    专利类型

  • 公开/公告日2016-07-06

    原文格式PDF

  • 申请/专利权人 FIRST SENSOR AG;

    申请/专利号EP20130155452

  • 发明设计人 PIERSCHEL MICHAEL;

    申请日2013-02-15

  • 分类号H01L31/107;H01L27/144;

  • 国家 EP

  • 入库时间 2022-08-21 14:51:53

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