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IN-SITU, MULTI-STAGE DEBULK, COMPACTION, AND SINGLE STAGE CURING OF THICK COMPOSITE REPAIR LAMINATES
IN-SITU, MULTI-STAGE DEBULK, COMPACTION, AND SINGLE STAGE CURING OF THICK COMPOSITE REPAIR LAMINATES
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机译:厚复合修复叠层的原位,多阶段调试,压缩和单阶段固化
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摘要
A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a bonding material to the exposed surface and forming an uncured ply stack assembly on the bonding material. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The ply stack assembly and bonding material are then cured.
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