Method for manufacturing an optical transmitter by growth of structures on a thin inp buffer bonded onto a silicon based substrate

摘要

A method is intended for manufacturing an optical transmitter (8) comprising structures (7₁-7₆) defining together transmission means. This method comprises a first step in which an InP wafer (3) is bonded on a substrate (1) comprising silicon, then this InP wafer (3) is made thinner to become an InP buffer (4), a second step in which a dielectric mask is laid onto this InP buffer (4), then openings (6) are patterned into chosen locations of this dielectric mask, and a third step in which the structures (7₁-7₆) are grown into corresponding patterned openings (6), then remaining parts of the dielectric mask are removed.