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POLYCRYSTALLINE ALUMINUM NITRIDE BASE MATERIAL FOR GROWING GaN BASED SEMICONDUCTOR CRYSTAL AND MANUFACTURING METHOD OF GaN BASED SEMICONDUCTOR USING THE SUBSTRATE
POLYCRYSTALLINE ALUMINUM NITRIDE BASE MATERIAL FOR GROWING GaN BASED SEMICONDUCTOR CRYSTAL AND MANUFACTURING METHOD OF GaN BASED SEMICONDUCTOR USING THE SUBSTRATE
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机译:用于生长GaN基半导体晶体的多晶铝氮化物材料以及利用该基体制造GaN基半导体的方法
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摘要
PROBLEM TO BE SOLVED: To provide a polycrystalline aluminum nitride substrate effective for crystal growing a GaN and GaN based semiconductor crystal using the polycrystalline aluminum nitride substrate.SOLUTION: A polycrystalline aluminum nitride base material 1 is a substrate material for grain growth of a GaN based semiconductor. A method of growing the GaN based semiconductor on a substrate using the polycrystalline aluminum nitride substrate, the substrate including a sintering additive component of 1-10 mass%, having a thermal conductivity of 150 W/mK or more, not having a concavity part with a maximum diameter of more than 200 μm on a substrate surface, having a substrate diameter L of 50 mm or more, having a skewness of -0.5-+0.5 on the substrate surface, and having a substrate 1 of which surface roughness (Ra) of 0.1 μm or less.SELECTED DRAWING: Figure 1
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机译:解决的问题:提供一种多晶氮化铝衬底,该多晶氮化铝衬底对于使用该多晶氮化铝衬底进行GaN和GaN基半导体晶体的晶体生长有效。解决方案:多晶氮化铝基底材料1是用于GaN基晶粒生长的衬底材料。半导体。一种使用多晶氮化铝衬底在衬底上生长GaN基半导体的方法,该衬底包括1-10质量%的烧结添加剂成分,具有150 W / mK或更高的热导率,且不具有凹陷部分。基板表面上的最大直径大于200μm,基板直径L为50 mm或更大,基板表面上的偏度为-0.5- + 0.5,并且基板1的表面粗糙度(Ra) 0.1μm或更小选择的图纸:图1
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