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Method and apparatus for reducing tin whisker growth on tin and tin plated surfaces by doping tin with gold
Method and apparatus for reducing tin whisker growth on tin and tin plated surfaces by doping tin with gold
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机译：通过用金掺杂锡来减少锡和锡表面上锡晶须生长的方法和装置
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摘要
The present disclosure relates generally to the field of tin electroplating. More specifically, the present disclosure relates to a method for reducing tin whisker formation on tin-plated films and tin-plated surfaces by doping tin with gold. [Selection] Figure 1a
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