首页> 外国专利> WATER ABSORBENT BODY FOR SILICON WAFER AND METHOD FOR DRYING SILICON WAFER USING THE SAME

WATER ABSORBENT BODY FOR SILICON WAFER AND METHOD FOR DRYING SILICON WAFER USING THE SAME

机译:硅晶片的吸水体及其干燥方法

摘要

PROBLEM TO BE SOLVED: To provide a water absorbent body for a silicon wafer excellent in water absorption, and a method for drying a silicon wafer in which the water absorbent body is used and a drying process can be shortened.;SOLUTION: A water absorbent body for a silicon wafer is used for being brought into contact with a silicon wafer surface to absorb and remove moisture on the silicon wafer surface, and the water absorbent body is a non-woven fabric made of a polyvinyl alcohol based resin. A method for drying a silicon wafer surface that has been cleaned using a cleaning liquid includes a step of bringing the water absorbent body for a silicon wafer into contact with a silicon wafer surface to absorb and remove moisture on the silicon wafer surface.;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供一种用于吸水性优异的硅晶片的吸水体,以及使用该吸水体并且可以缩短干燥过程的干燥硅晶片的方法。用于硅晶片的主体用于与硅晶片表面接触以吸收和去除硅晶片表面上的水分,并且吸水主体是由聚乙烯醇基树脂制成的无纺布。用于干燥已经用清洁液清洁的硅晶片表面的方法包括使硅晶片吸水体与硅晶片表面接触以吸收和去除硅晶片表面上的水分的步骤。 (C)2016,日本特许厅&INPIT

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号