TREATMENT AGENT FOR PREVENTING DEPOSITION OUTSIDE METAL PATTERN, PRINTED CIRCUIT BOARD USING THE SAME AND METHOD FOR MANUFACTURING PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a treatment agent for preventing electroless plating from being deposited outside a pattern, capable of suppressing the time degradation of the treatment agent, concretely the consumption of hydrogen peroxide in an alkali region on the condition that the hydrogen peroxide directly contributes to the inactivation of a Pd residue is used, and removing the Pd residue causing the electroless plating deposited outside the pattern while suppressing the dissolution of under layer metal.SOLUTION: The treatment agent for preventing electroless plating from being deposited outside a pattern comprises hydrogen peroxide and one or more compounds selected from a group consisting of aldose, aldonic acid, aldaric acid, these salts and these lactones, and has a pH of 7.1 or more.SELECTED DRAWING: Figure 1