Use of materials to improve structural rigidity, reduce size, improve safety, and improve thermal performance and fast charging in small form factor devices

摘要

The system and method include a housing, one or more electronic components disposed within the housing, and a first cured resin composition disposed within the housing and including a thermal energy storage material and a first filler material. A device may be provided. The device may also include a second cured resin composition disposed within the housing and including a thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, and the first cured resin composition and the second cured resin composition include at least one of one or more electronic components. Good. In other examples, the electronic component includes a power source and the device complies with the ATEX equipment directive for explosive atmospheres. In addition, component underfill and / or assembly overmolding may be used to fabricate the device.