COPPER CLAD CERAMIC CIRCUIT BOARD, ELECTRONIC APPARATUS WITH THE SAME PACKAGED THEREIN, AND MANUFACTURING METHOD OF COPPER CLAD CERAMIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper clad ceramic circuit board which improves reliability by reducing a fault caused by exfoliation of a junction interface of ceramics and destruction of a ceramic plate with respect to heat that is applied during manufacture or usage, and a device with the same packaged therein.SOLUTION: In the copper clad ceramic circuit board, a circuit board 10 is configured by bonding copper plates 12 to one side or both sides of a ceramic plate 11. The copper plate 12 on at least one side is an orientated copper plate 12 having a 100 main azimuth in a normal direction of a surface of the circuit bard 10 and in any one direction within a surface of the copper plate 12 on the circuit board 10. In a 100 preferential orientation region, the crystal axis 100 satisfies the conditions that an azimuth difference is within 15° with respect to the normal direction of the surface of the circuit board 10 and that the azimuth difference is within 15° with respect to any one direction within the surface of the cooper plate 12 on the circuit board 10. An area rate of the 100 preferential orientation region is 80% or more and 100% or less. An electronic apparatus with the copper clad ceramic circuit board packaged therein and a manufacturing method of the copper clad ceramic circuit board are also disclosed.SELECTED DRAWING: Figure 1