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LASER PROCESSING SYSTEM, CONDITION CORRECTOR, AND LASER PROCESSING METHOD

机译:激光加工系统,状态校正器和激光加工方法

摘要

PROBLEM TO BE SOLVED: To provide a laser processing system which easily colors a workpiece in a desired color with high precision.SOLUTION: A laser processing system 1 comprises a laser head 12 that irradiates a testing workpiece WT (workpiece W) of a marking processing target with a laser beam LB, a color acquisition part 20 that acquires color information on the testing workpiece WT when the workpiece is irradiated with the laser beam LB from a laser processing machine 2, a function generation part 21 that calculates a function which represents a relation of energy given to the testing workpiece WT by irradiation with the laser beam LB with the color information, and a condition correcting part 22 that corrects the processing condition during marking processing of the workpiece W on the basis of the function.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种激光加工系统,该激光加工系统容易地将工件高精度地着色为期望的颜色。解决方案:激光加工系统1包括激光头12,该激光头12照射标记处理的测试工件WT(工件W)。以激光束LB为目标的颜色获取部分20,当从激光加工机2向工件照射激光束LB时,获取关于被测工件WT的颜色信息的颜色获取部分20;计算函数的函数生成部分21,该函数表示带有颜色信息的激光束LB照射给被测工件WT的能量与条件校正部件22之间的关系,该条件校正部件22根据该功能校正工件W的打标加工过程中的加工条件。 1个

著录项

  • 公开/公告号JP2016175120A

    专利类型

  • 公开/公告日2016-10-06

    原文格式PDF

  • 申请/专利权人 MURATA MACH LTD;

    申请/专利号JP20150059266

  • 发明设计人 MATSUMOTO KEITA;

    申请日2015-03-23

  • 分类号B23K26/00;

  • 国家 JP

  • 入库时间 2022-08-21 14:45:00

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