首页> 外国专利> Method Of And System For Setting Laser Processing Conditions, Laser Processing System, Computer Program For Setting Laser Processing Conditions, Computer Readable Medium and Recording Device On Which Laser Processing Conditions Are Recorded

Method Of And System For Setting Laser Processing Conditions, Laser Processing System, Computer Program For Setting Laser Processing Conditions, Computer Readable Medium and Recording Device On Which Laser Processing Conditions Are Recorded

机译:设定激光加工条件的方法和系统,激光加工系统,用于设定激光加工条件的计算机程序,计算机可读介质和记录激光加工条件的记录装置

摘要

A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone.
机译:公开了一种用于计算机辅助激光加工设备的设置加工数据的方法,以及用于设置激光加工数据的系统。该方法包括将对象的三维轮廓和处理图案设置为处理条件的功能,生成表示对象的处理条件的处理数据的功能以及以可视方式显示处理的二维表示的功能。在显示屏上显示数据,并具有将对象的三维轮廓和处理图案设置为处理条件的功能,其中可以在将对象二维显示在屏幕上的同时设置三维轮廓和处理图案。显示屏位于处理区内。

著录项

  • 公开/公告号US2012061360A1

    专利类型

  • 公开/公告日2012-03-15

    原文格式PDF

  • 申请/专利权人 MAMORU IDAKA;HIDEKI YAMAKAWA;

    申请/专利号US201113301863

  • 发明设计人 HIDEKI YAMAKAWA;MAMORU IDAKA;

    申请日2011-11-22

  • 分类号B23K26/03;

  • 国家 US

  • 入库时间 2022-08-21 17:33:48

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