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Temperature compensation information to create a method and a method of manufacturing an electronic parts

机译:温度补偿信息以创建一种方法和一种制造电子零件的方法

摘要

PROBLEM TO BE SOLVED: To provide a temperature compensation information generation method or the like capable of generating temperature compensation information that performs temperature compensation of frequency temperature characteristics of an oscillation element with high accuracy in consideration of variations in frequency adjustment sensitivity while suppressing an increase in detection costs for electronic components.;SOLUTION: A temperature compensation method includes the steps of: measuring frequency temperature characteristics and a crystal constant of a crystal transducer 20 (S12); assembling a temperature compensated crystal oscillator (TCXO) 1 by using the crystal transducer 20 and an oscillation control IC 10 for controlling oscillation of the crystal transducer 20 (S30); and generating temperature compensation information by using information of the frequency temperature characteristics and the crystal constant of the crystal transducer 20 (S42).;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种温度补偿信息生成方法等,其能够生成频率补偿信息,该温度补偿信息考虑到频率调节灵敏度的变化而在抑制振荡的增加的同时高精度地执行对振荡元件的频率温度特性的温度补偿。解决方案:温度补偿方法包括以下步骤:测量晶体换能器20的频率温度特性和晶体常数(S12)。通过使用晶体换能器20和振荡控制IC 10组装温度补偿晶体振荡器(TCXO)1来控制晶体换能器20的振荡(S30);通过使用晶体换能器20的频率温度特性和晶体常数的信息来生成温度补偿信息(S42)。版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP5971467B2

    专利类型

  • 公开/公告日2016-08-17

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20120114769

  • 发明设计人 徳橋 元弘;

    申请日2012-05-18

  • 分类号H03H3/04;H03H9/02;H03B5/32;H01L41/22;H01L41/18;H01L41/09;H01L41/08;G01C19/5614;G01C19/5628;

  • 国家 JP

  • 入库时间 2022-08-21 14:44:59

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