METHOD FOR MANUFACTURING SELF-SUPPORTING COPPER THIN FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper thin film, capable of efficiently manufacturing a self-supporting copper thin film having a lower resistance.;SOLUTION: The method for manufacturing a copper thin film comprises: a step S1 of forming the copper thin film having a film thickness of 2-30 μm on the surface of a substrate having a surface consisting of a ceramic material constituted of a compound of aluminum and/or silicon and at least one kind of elements selected from a group consisting of oxygen, nitrogen and carbon or carbon by setting a temperature of a vapor deposition source to 1200°C or more and circulating inert gas so as to be a total pressure of 0.001-10 Pa; and a step S2 of peeling the formed copper thin film in a thin film state from the surface of the substrate.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT