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Polishing composition and polishing method for bulk silicon
Polishing composition and polishing method for bulk silicon
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机译:块状硅的抛光组合物和抛光方法
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摘要
The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increase the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
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