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Chip-to-chip interface using low-power, high-speed multi-channel dielectric waveguide
Chip-to-chip interface using low-power, high-speed multi-channel dielectric waveguide
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机译:使用低功耗,高速多通道介电波导的芯片到芯片接口
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摘要
Exemplary embodiments of the present invention provide an improved dielectric waveguide referred to as an electrical fiber. A battery-powered fiber with metal cladding typically causes signal interference in different radio channels and adjacent electrical fibers, causing bandwidth-limitation problems, and total transceiver power consumption due to increased transmission distance. Can be isolated for smaller radiation loss and better signal guide to reduce In addition, the electrical fibers are frequency independent, allowing for high data rates, even if there is little or no additional receiver compensation due to the vertical coupling of the electrical fibers and interconnects. Can have damping characteristics.
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