MANUFACTURING METHOD OF RESIN-SEALED ELECTRONIC COMPONENT, TABULAR MEMBER WITH BUMP ELECTRODE, RESIN-SEALED ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF TABULAR MEMBER WITH BUMP ELECTRODE

摘要

PROBLEM TO BE SOLVED: To provide a simple and efficient manufacturing method of a resin-sealed electronic component including both a via electrode (bump electrode) and a tabular member.;SOLUTION: In the manufacturing method of the resin-sealed electronic component sealing an electronic component 31 with a resin, the resin-sealed electronic component includes a substrate 21, an electronic component 31, a resin 41, a tabular member 11 and a bump electrode 12, and the manufacturing method includes a resin sealing step of forming a wiring pattern 22 on the substrate 21 and sealing the electronic component 31 with the resin 41. In the resin sealing step, the bump electrode 12 is fixed on one side of the tabular member 11 and the bump electrode 12 includes a deformable part 12A that can be shrunk in a direction vertical to a surface direction of the tabular member 11. The electronic component 31 is sealed with the resin 41 between a surface of a tabular member 10 with the bump electrode on which the bump electrode 12 is fixed, and a surface of the substrate 21 on which the wiring pattern 22 is formed, and the bump electrode 12 is brought into contact with the wiring pattern 22.;SELECTED DRAWING: Figure 6;COPYRIGHT: (C)2016,JPO&INPIT