Lead frame for an optical semiconductor device, lead frame for resin-optical semiconductor device, multi with body of the lead frame, multi with body of the resin with the lead frame, the optical semiconductor device, multi with body of an optical semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide an optical semiconductor device lead frame, an optical semiconductor device lead frame with resin, a multifaceted body of a lead frame, a multifaceted body of a lead frame with resin, an optical semiconductor device and a multifaceted body of an optical semiconductor device that can suppress exfoliation between a resin layer and a terminal portion.;SOLUTION: In a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to the surface of at least one of terminal portions 11, 12, the terminal portion 11 is alternately provided with a recess portion M1 concaved from the surface thereof and a recess portion M2 concaved from the back surface thereof on one side of the terminal portion 11 which confronts the terminal portion 12. The terminal portion 12 has a recess portion M3 concaved from the surface thereof at a position confronting the recess portion M2, and a recess portion M4 concaved from the back surface thereof at a position confronting the recess portion M1. When resin 20 is filled on the outer peripheral side surfaces of the respective terminal portions 11, 12 and between the terminal portions, the confronting sides of the terminal portions 11 and 12 which are exposed to the back surface of the optical semiconductor device 1 are linear.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT