Lead frame for an optical semiconductor device, lead frame for resin-optical semiconductor device, multi with body of the lead frame, multi with body of the resin with the lead frame, the optical semiconductor device, multi with body of an optical semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor device capable of restraining peel-off between a resin layer and a terminal part, a lead frame for an optical semiconductor device with a resin, a multiple mounted component of the lead frame, a multiple mounted component of the lead frame with the resin, an optical semiconductor device, and a multiple mounted component of the optical semiconductor device.;SOLUTION: A lead frame 10 is used for an optical semiconductor device having a plurality of terminal parts 11, 12 in which at least one of terminal parts is connected to an LED element 2, a recess part M connected to outer peripheral sides of terminal parts 11, 12, is formed on surfaces of terminal parts 11, 12, and the recess part M has a convex part T in a position away from an inner peripheral side of the recess part M, on its bottom surface.;COPYRIGHT: (C)2014,JPO&INPIT